Samsung sets up laboratory in the United States to develop next-generation 3D DRAM

According to industry insiders, Samsung Electronics, the world's largest memory chip manufacturer, has set up a new research laboratory in the United States to develop a new generation of 3DDRAM. The laboratory is affiliated with Device Solutions America (DSA), which is headquartered in Silicon Valley and is responsible for Samsung's semiconductor production in the United States. It will be dedicated to developing upgraded DRAM models to enable Samsung to lead the global 3D memory chip market.

In October last year, Samsung Electronics revealed that it was preparing a new 3D structure for DRAM below 10 nanometers, allowing for larger single-chip capacity that can exceed 100 gigabits.

Samsung Electronics successfully commercialized 3D vertical NAND flash memory for the first time in the industry in 2013.