According to the latest report from MarketsandMarkets, the global interposer and FOWLP (fan-out package without substrate) market is expected to be worth US$35.6 billion in 2024 and is expected to reach US$63.5 billion by 2029; it is expected to grow at a compound annual growth rate of 12.3% during the forecast period. The growing demand for advanced packaging for artificial intelligence (AI) and high-performance computing (HPC) is a major driver of the interposer packaging and FOWLP market.
The semiconductor industry is experiencing strong growth as interposer-based packaging technology improves performance and reduces power consumption by facilitating efficient connections between different chip components. This technology plays an increasing role in enabling high-bandwidth and high-performance applications, driving the development of data centers, 5G infrastructure and emerging technologies.
Interposer and FOWLP have the highest market share in the 2.5D packaging market by package type during the forecast period.
The 2.5D integrated circuit packaging market is witnessing significant growth as it enables higher performance and miniaturization by stacking multiple chips on middleware, promoting the development of high-performance computing, artificial intelligence, and automotive electronics. This packaging method meets the needs for improved efficiency, reduced power consumption and increased bandwidth in a wide range of applications, so its application in various industries continues to expand.
The interposer and FOWLP market for memory devices will occupy a high market share during the forecast period.
Growing demand for high-capacity, high-speed memory solutions in applications such as data centers, artificial intelligence, and 5G has driven innovation in packaging technologies to optimize performance and efficiency, thereby driving the growth of semiconductor packaging for memory devices. Advanced packaging technologies, including three-dimensional stacking and heterogeneous integration, play a vital role in meeting the evolving requirements of memory devices and increasing their speed, density and energy efficiency.
North America will hold the second largest share of the intermediary and FOWLP market during the forecast period.
North America holds the second largest share in the intermediary and FOWLP industry, mainly due to several key factors. The region has a highly developed technology environment, with major players in the semiconductor packaging industry based here. The North American semiconductor advanced packaging industry is an important area driving innovation in electronic devices, characterized by the use of cutting-edge technologies such as 3D packaging and heterogeneous integration to improve performance and miniaturization. It plays a key role in the region's technology ecosystem, promoting advancements in computing, communications and various electronic applications.
major players
Interposer and FOWLP companies include many major Tier 1 and Tier 2 players, such as Samsung (South Korea), TSMC (Taiwan), SKHynix (South Korea), etc., which hold important positions in the advanced packaging market in North America, Europe, Asia Pacific and Rest of the World (RoW).