Intel announced the launch of an immersion liquid cooling system with Submers, called "Forced Convection Heat Sink (FCHS)", which can dissipate heat for chips with a thermal design power of 1000W and above.It is reported that in this immersed liquid cooling system,A copper radiator is equipped with two fans on one end to enhance the flow of liquid through the radiator by forcing convection.However, the design of this component conflicts with the traditional passive concept of immersion cooling based on natural convection.
In the early days, Intel used Xeon server processors with a TDP of 800W for demonstration, and the next step is to increase the TDP to 1000W.
In addition, this immersion liquid cooling system is designed to be easy to manufacture and cost-effective. Some of its components can also be manufactured using 3D printing to better customize the corresponding heat dissipation design.
Visit the purchase page:
Intel Flagship Store