Driven by global AI demand, TSMC's advanced process and packaging capabilities have become extremely popular. According to media reports,TSMC plans to adjust prices for 3nm and 5nm advanced processes and CoWoS packaging processes starting from January 2025.
Among them, the price increase of 3nm and 5nm processes will be between 5% and 10%, while the price increase of CoWoS packaging process will be 15% to 20%.
TSMC’s third quarter financial report shows that 3nm and 5nm processes accounted for 20% and 32% of the company’s wafer sales in the quarter respectively, and the two together accounted for 52% of quarterly revenue.
At the same time, for mature processes, TSMC will provide mid-single-digit percentage foundry price discounts to customers whose production volume reaches a certain scale to reduce the competitiveness pressure on customers.
Other wafer foundries such as UMC have also followed TSMC's lead and lowered prices for mature processes by similar margins. The specifics vary depending on the customer's wafer volume and newly launched products.