TSMC, the leading wafer foundry, is located in Nanke's wafer fab. After the earthquake-affected machine equipment and wafer damage were repaired, the supply chain reported that the 3 and 5 nanometer advanced process wafer fab 18 is expected to reach 100% resumption on the 23rd and is ready to resume normal production. There is no clear timetable for the resumption of wafer fab 14.
In the early morning of January 21, an earthquake measuring 6.4 on the Richter scale occurred in Taiwan. The maximum magnitude measured at TSMC's wafer fab in Nanke was magnitude 5, which had the greatest impact. In order to ensure the safety of personnel, the factory initiated relevant safety precautions in accordance with the company's internal procedures and evacuated personnel as soon as possible. An inventory of all personnel was completed at about 1 a.m. to confirm that all personnel were safe. Each factory also completed post-earthquake damage inspections of buildings to confirm that the structures were safe.
TSMC confirmed that personnel and factory buildings were safe, and immediately summoned production line personnel, equipment and other suppliers after the earthquake to carry out follow-up repairs such as machine equipment shifts and wafer damage. The supply chain pointed out that the 3 and 5 nanometer advanced process wafer fabs are newly built and have a high earthquake resistance coefficient. It is estimated that the impact of equipment shifting and other factors will be about 30-40%. "The impact of the machine is not inferior to last year's 0403 earthquake." An inventory of the damaged wafers in fabs 18A and 18B is estimated to be between 25,000 and 30,000.
TSMC's 12-inch wafer fab 14 has an older building and mature production processes. The earthquake damage is not light. According to the supply chain, it is estimated that half of the machine equipment is affected. There are more than 30,000 damaged and scrapped wafers in fab 14A and 14B. The overall losses of Fab 18 and Fab 14 may be as high as the 0403 earthquake, reaching more than 3 billion yuan.
According to reports from the supply chain, TSMC expects that its 18th wafer fab will be 100% resumed on the 23rd and is ready to resume normal production. Fab 14 is still undergoing full rescue efforts, and there is currently no timetable for resumption of production.
TSMC has previously stated that it is safe
A magnitude 6.4 earthquake occurred in Taipo, Chiayi in the early morning of the 21st, with continued aftershocks. The Ministry of Economic Affairs has taken stock of any disaster damage in Chiayi and Tainan industrial parks and will initiate special inspections of reservoirs. TSMC also issued a latest statement stating that some central and southern factories were evacuated as soon as possible and that factory personnel and building structures are safe.
TSMC pointed out that the company's wafer fab in the Southern Science Park measured a maximum magnitude of 5, the Central Science Park fab had a maximum magnitude of 4, and the Hsinchu Science Park wafer fab (including Longtan and Zhunan) measured a maximum magnitude of 3. Relevant safety precautions have been initiated.
TSMC stated that some central and southern factories were evacuated as soon as possible, and all inventories were completed at 1 a.m., and all personnel were safe. Each factory also completed post-earthquake damage inspections of buildings, confirming that the structures were safe and gradually returned to the line. At present, the water supply, electricity, and industrial safety systems and operations of each factory are normal, and various detailed inspections and detailed impact assessment operations are ongoing.
Subsequently, TSMC issued a statement stating that each factory has completed post-earthquake damage inspections of buildings and confirmed that the structures are safe and are gradually returning to line. At the same time, the company's factory construction site has not been affected, and construction continues as usual today after the post-earthquake environmental safety inspection. It is emphasized that the water supply, electricity, and industrial safety systems and operations of each factory area are normal.
TSMC's statement also stated that the company's wafer fab in the Southern Science Park measured a maximum earthquake magnitude of 5, the Central Science Park wafer plant had a maximum magnitude of 4, and the Hsinchu Science Park wafer fab (including Longtan and Zhunan) had a maximum magnitude of 3.
In order to ensure the safety of personnel, after the earthquake, each factory area initiated relevant safety precautions in accordance with the company's internal procedures. Some central and southern factories were evacuated as soon as possible, and an inventory was completed at about 1 a.m. to confirm that all personnel were safe. Each factory area has also completed post-earthquake damage inspections of buildings, confirming that the structures are safe and gradually returning to line.