This afternoon, MediaTek held a new product launch conference for Dimensity.Officially released Dimensity 83005G generative AI mobile chip, known as "ice peak energy efficiency, super evolution".As a new member of the Dimensity 8000 series family, the Dimensity 8300 features advanced generative AI technology and high energy efficiency.
Specifically, the Dimensity 8300 uses TSMC’s second-generation 4nm process and is based on the Armv9 CPU architecture.
The eight-core CPU is composed of 4 Cortex-A715 performance cores and 4 Cortex-A510 energy efficiency cores. Officials say that the CPU peak performance is 20% higher than the previous generation and power consumption is reduced by 30%.
In terms of GPU, Dimensity 8300 is equipped with 6-core GPUMali-G615.GPU peak performance is 82% higher than the previous generation, and power consumption is reduced by 55%.
At the same time, Dimensity 8300 also supports LPDDR5X8533Mbps memory, as well as UFS4.0 flash memory and multi-cyclic queue technology. The memory transfer rate is increased by 33% compared with the previous generation, and the flash memory read and write rate is increased by 100%.
Thanks to MediaTek's new "Star Speed Engine", the Dimensity 8300 uses a unique performance algorithm to perform real-time resource scheduling based on application performance requirements and device temperature, bringing a gaming experience with high frame stability, low power consumption and long battery life.
In addition to significantly improved performance compared with the previous generation, Dimensity 8300 is also the first product of its class to support generative AI.
It is understood thatDimensity 8300 supports up to 10 billion parameter AI large language model and integrates MediaTek AI processor APU780.Equipped with a generative AI engine, the performance of integer operations and floating point operations is twice that of the previous generation.
It also supports Transformer operator acceleration and mixed-precision INT4 quantization technology. The overall AI performance is 3.3 times that of the previous generation, and it can smoothly run innovative applications of terminal-side generative AI.
It is worth mentioning that MediaTek has also jointly created end-side generative AI with Xiaomi.
On the network, Dimensity 8300 integrates a 3GPPR165G modem, which is optimized for specific scenarios and can achieve smoother 5G connections in network environments with weak signals.
At the same time, it also enhances the connection performance and range of the Sub-6 GHz network to support 3 carrier aggregation, and the theoretical peak downlink rate can reach 5.17Gbps.
Officially stated,With the support of MediaTek 5G UltraSave3.0+ power-saving technology, 5G communication power consumption can be reduced by up to 20%.
In addition, the chip supports Wi-Fi 6E and Wi-Fi Bluetooth hyper-connection technology, allowing the phone to simultaneously connect to peripherals such as Bluetooth headsets and wireless controllers with lower latency.
In other aspects, Dimensity 8300 is equipped with a 14-bit HDR-ISPImagiq980 image processor, which can shoot 4K60HDR video and supports Dimensity open architecture.
Regarding the Dimensity 8300, digital blogger "Digital Chat Station" previously stated that the theoretical performance of the chip can surpass the Snapdragon 7+, and the AnTuTu running score can even exceed the Snapdragon 8+.
Overall, with the support of powerful performance and generative AI, Dimensity 8300 will become a new generation of word-of-mouth god U, which is worth looking forward to.