Taiwan currently has two factories focused on 2nm production: the Baoshan and Kaohsiung factories. According to reports, during trial production, TSMC’s initial wafer production target at the Kaohsiung factory is 5,000 wafers, as is the output target at the Baoshan factory. Now, the detailed information published by the whistleblower @Jukanlosreve in the Economic Daily mentioned that according to the current progress level, TSMC has the ability to achieve the goal of monthly production of 50,000 wafers by the end of this year.
TSMC has achieved a 60% yield milestone in its trial production phase, which will soon move into full production as the Taiwanese foundry giant continues to increase production to meet customer demand for next-generation chips in a variety of applications. Sources familiar with the matter said the company's monthly wafer production may reach 50,000 wafers and may reach 80,000 wafers by the end of 2025.
TSMC has a factory in Taiwan that can produce up to 25,000 wafers per month, but rumors suggest the company is still looking for a way out of the trial production phase.
However, if there are no problems during the production process, this number is entirely possible to reach 80,000 units. Unfortunately, TSMC has not made any confirmation on this, and the foundry giant only said that it is making progress in this regard. Industry insiders close to the company's plans mentioned that the Baoshan factory's production capacity has reached 25,000 wafers per month, which only means that the remaining 25,000 wafers will be mass-produced by the Kaohsiung factory.
In horizontal comparison, the company performed significantly better than Samsung, which only achieved a 30% yield rate of its 2-nanometer GAA technology during the trial production phase of Exynos2600.