Since Samsung’s 3nm GAA process technology wafer yield is still not ideal,Qualcomm’s next generation processor, Snapdragon 8Gen4, will cancel the dual foundry strategy of TSMC and Samsung,It will be exclusively manufactured by TSMC.TSMC’s legal representative also estimates that TSMC’s 3-nanometer monthly production capacity is expected to increase to 100,000 pieces in the second half of next year as major customers such as Qualcomm and Nvidia compete to use it.

According to reports not long ago, Samsung’s complete 3nm GAA wafers are difficult to produce.And the yield rate is only 50%,The chip cost is 40% higher than the 70% yield rate.

There are five 3nm processes planned by TSMC, namely N3B, N3E, N3P, N3S and N3X. N3B is its first 3nm node that has been mass-produced.The yield rate has reached about 70%-80%.

N3E is an enhanced version of N3B, but judging from the technical data disclosed by TSMC, its yield rate is higher and the cost is lower.But the performance will be slightly lower than N3B.

Considering cost and performance, it is not surprising that Qualcomm’s next-generation flagship chip Snapdragon 8Gen4 will abandon Samsung’s foundry and be exclusively manufactured by TSMC.