The Ministry of Commerce issued an announcement to launch an anti-dumping investigation into imported analog chips originating in the United States.According to the announcement, the Ministry of Commerce received an anti-dumping investigation application formally submitted by the Jiangsu Semiconductor Industry Association (hereinafter referred to as the applicant) on behalf of the relevant domestic analog chip industry on July 23, 2025. The applicant requested an anti-dumping investigation into imported relevant analog chips originating in the United States.
In accordance with the relevant provisions of the Anti-dumping Regulations of the People's Republic of China, the Ministry of Commerce reviewed the applicant's qualifications, the situation related to the products applied for investigation, the situation related to similar Chinese products, the impact of the products applied for investigation on the domestic industry, and the situation related to the country applied for investigation. According to the evidence provided by the applicant and the preliminary review by the Ministry of Commerce, the total output of the applicant’s relevant analog chips meets the requirements for applicant qualifications in the Anti-dumping Regulations of the People’s Republic of China.
At the same time, the application contains the content and relevant evidence required for filing an anti-dumping investigation as stipulated in Articles 14 and 15 of the Anti-dumping Regulations of the People's Republic of China.
Based on the above review results and in accordance with Article 16 of the Anti-dumping Regulations of the People's Republic of China, the Ministry of Commerce decided to initiate an anti-dumping investigation into imported analog chips originating in the United States starting from September 13, 2025.
The announcement is as follows:
1. Case filing and investigation period
From the date of this announcement, the Ministry of Commerce has launched an anti-dumping investigation into imported analog chips originating in the United States. The dumping investigation period determined in this investigation is from January 1, 2024 to December 31, 2024, and the industrial damage investigation period is from January 1, 2022 to December 31, 2024.
2. Products under investigation and scope of investigation
Scope of investigation: Import-related analog chips originating in the United States.
Name of product under investigation: related analog chips.
English name: Certain Analog IC Chip.
Product description and main uses: Common interface chips (Commodity Interface IC Chip) and gate driver IC chips (Gate Driver IC Chip) using 40nm and above process processes in related analog chips.
in:
A universal interface chip is an integrated circuit chip designed to provide diverse interface types for connecting various devices, systems or components to achieve efficient data transmission and signal conversion. The universal interface chips under investigation include:
1. Controller Area Network (CAN, Controller Area Network) interface transceiver chip that complies with ISO11898 standards and is used for sending and receiving signals between systems in automobiles and other industrial products;
2. RS485 interface transceiver chip that complies with TIA/EIA-485 standard and is used for sending and receiving signals between various types of equipment in industrial systems;
3. A bidirectional two-wire synchronous serial bus (I2C) interface chip based on a low-speed serial bus method using serial data lines and serial clock lines, used for switching and expansion of signal buffer relay channels between various types of boards or chips in equipment;
4. Digital isolator chips that comply with the International Electrotechnical Commission IEC 60747-5-2 standard are used for insulating communication between high and low voltage systems in automobiles and other industrial products, or for enhancing communication anti-interference performance;
5. Other universal interface chips compatible with the above types.
The gate driver chip is an integrated circuit chip used to enhance the gate control signal output of the controller and control the on and off of power semiconductor devices. Gate drive chips provide the necessary voltage and current levels to effectively turn these semiconductor switches on and off, enabling the conversion and control of electrical energy. The gate driver chips under investigation include:
1. Low-Side Gate Driver IC Chip;
2. Half-Bridge/Multi-Channel Gate Driver IC Chip;
3. Isolated Gate Driver IC Chip.
The gate drive chip under investigation has the following functions: 1. Convert the low-voltage signal of the controller into a higher voltage or larger current drive signal to achieve stable turn-on and turn-off of the power device; 2. Provide transient pulling and sinking current to increase the switching speed of the power device and reduce switching losses.
The general interface chips and gate driver chips under investigation include finished chips and wafers and dies that can be used to produce chips with the same functions, as well as products with the same functions developed in the future.
This product is classified under the "Import and Export Tariffs of the People's Republic of China": 85423990. Other products under this tariff number are not within the scope of this investigation.