At the SK AI Summit held in South Korea, SK Hynix announced its future storage plan roadmap. As one of the three major original manufacturers, it naturally has quite a say. According to the plan, saveThe next major node for storage will be around 2030, or 2029-2031, various technical standards will be completely upgraded.
In terms of traditional memory,DDR6 memory and GDDR8 video memory are both under preparation, among which DDR6 is progressing faster, the three major manufacturers have completed prototype design and are undergoing verification tests. The starting frequency is expected to be as high as 8800MT/s, and may reach a maximum of 17600MT/s.
GDDR8 is still very early, and even the road map only says "GDDR7-NEXT", and it is not ruled out that it is called GDDR7X.
In fact, GDDR7 video memory is currently only used by NVIDIA RTX 50 series, and AMD has not yet launched it.
The mobile version of LPDDR6 was just announced recently, and naturally the next one is LPDDR7, but it is not clearly listed.
Of course, with the strong promotion of AI, HBM is the top priority.We will soon see HBM4 and HBM4E, NVIDIA and AMD accelerator cards will be arranged one after another.After that there are HBM5 and HBM5E, also planned around 2030.
In terms of storage, PCIe 5.0 is continuing to advance, and will soon reach a single disk of 245TB or even larger (of course QLC). UFS 5.0 has just been finalized, and PCIe 6.0 will be launched next.In the future, we will see PCIe 7.0, UFS 6.0, and 400+ layers of stacked flash memory.
