According to ET News,Samsung Electronics plans to open its independently developed HPB (Heat Pass Block) packaging technology to external customers, and the first batch of cooperation partners may include Qualcomm and Apple.
This technology is specially designed for high-performance chip heat dissipation. By integrating high-efficiency heat sinks directly on the chip, it significantly improves thermal management efficiency.
The actual measured data shows thatIt can reduce the average operating temperature of the chip by 30%, helping the SoC to maintain peak performance frequency for a long time.
Although Apple has shifted foundry orders to TSMC for its A10 chips in 2016, Qualcomm will also hand over orders for Snapdragon 8 Gen 1+ to TSMC in 2022.Samsung is still trying to use HPB technology as a breakthrough to attract customers back.
This move may not only reshape the competitive landscape of the chip foundry market, but also highlight Samsung's goal of regaining high-end manufacturing processes through cutting-edge packaging technology.