MediaTek's Dimensity series chips will be manufactured by Intel. This news has attracted widespread attention in the semiconductor industry.After Apple initially finalized the use of Intel's 18A process, Intel seems to have won over its second largest customer, MediaTek, which is expected to use Intel's 14A process.
As we all know,Apple may choose Intel's 18A-P process for its entry-level M series chips, which will be shipped as soon as 2027.More than that, Apple is expected to launch customized ASICs in 2028 that will use Intel's EMIB packaging technology. Apple has signed a confidentiality agreement with Intel and obtained PDK samples of its 18A-P process for evaluation.
It is worth noting that Intel’s 18A-P process is its first node to support Foveros Direct 3D hybrid bonding technology, which allows the stacking of multiple die through silicon vias.
Now there is a bold rumor that Intel has successfully attracted another 14A process customer MediaTek. However, it is not easy to apply Intel's 14A process to mobile chips such as MediaTek's Dimensity series. Intel decided to fully invest in back-side power supply technology on the 18A and 14A nodes. Although this decision can significantly improve performance, it will also bring serious self-heating effects.
Since the internal space of mobile phones is extremely limited, this self-heating effect is a severe challenge for mobile SoCs, and additional cooling measures may be required to ensure stable operation. If both parties can successfully overcome this technical bottleneck, the possibility of in-depth cooperation between MediaTek and Intel cannot be ruled out.
