This week, with the grand opening of the "Semicon Korea 2026" semiconductor exhibition in South Korea on February 11, the industry's eyes are focused on the cutting-edge storage manufacturing equipment to be unveiled by Hanmi Semiconductor. According to Korean media reports, the company demonstrated its latest "Wide TC Bonder" equipment at a newly established booth at the exhibition. Related promotional materials show that this new technology is positioned as a powerful alternative to hybrid bonding (Hybrid Bonder) technology in the mass production of high-bandwidth memory (HBM).
The commercialization of hybrid bonding equipment has been delayed many times due to widespread technical difficulties, and Hanmi Semiconductor's Wide TC Bonder, scheduled to be launched in the second half of 2026, is expected to fill this market gap with its unique advantages.
According to exclusive news obtained by Chosun Biz before the official release of the product, Hanmi Semiconductor representatives revealed that this new standard equipment uses advanced fluxless precision bonding technology, which can significantly improve the yield, quality and integrity of HBM production.
While these enhancements will directly benefit the upcoming HBM4 production lines, Hanmi Semiconductor's longer-term vision is to establish it as a key factory technology for manufacturing future HBM5 and HBM6 products. This strategic layout echoes the industry roadmap jointly released by KAIST and TERA last summer, which predicts that HBM4 will debut with the NVIDIA “Rubin” architecture AI accelerator in 2026, while HBM7 is expected to be available in the late 2030s, demonstrating the industry’s continued thirst for higher-performance storage stacking technology.
