Everyone should already know that Intel's next-generation desktop processor Nova Lake-S will use a new packaging interface, with the mainstream grade being LGA1954 and the enthusiast grade being LGA4326. The currently used LGA1851 has thus become a super short-lived device that only lasts one generation. In addition to changes in the number of pins, the new socket in the form of LGA1954 will also add an optional "2L-ILM", which is a "two-lever independent loading mechanism", that is, there are two pressure levers on the left and right sides of the socket instead of the traditional one on one side.
It will not become a standard feature of the new socket on all motherboards, but will only be available to enthusiasts, overclockers and gamers.
The purpose of this design is to improve the flatness of the processor heat dissipation top cover (IHS) and ensure that the processor and the heat sink are in as close contact as possible, thereby improving thermal efficiency.
The last time Intel did this was on the LGA2011 fever platform, with the same purpose, and it has never appeared on subsequent mainstream platforms.
LGA2011
In fact, on the current Arrow Lake LGA1851 platform, most high-end motherboards are enhanced versions of "RL-ILM", while the mainstream ones are the default ILM.
Cooler Master, Noctua and other cooling manufacturers provide support for both mechanisms respectively.
The earlier Alder Lake 12th generation Core and Raptor Lake 13/14th generation Core are all standard LGA1700 ILM. Some enthusiasts are not satisfied with the default solution and have designed various contact frame modifications and gasket correction solutions.
I hope that I won’t have to worry about it anymore in the future, but the pressure will be greater when the pressure is tighter. You may have to be careful when installing it, so as not to crush it by force.
LGA1851