Chinese memory chip manufacturer Changxin Memory (CXMT) has launched mass production of 12-layer high-bandwidth memory HBM.The implementation of 12-layer stacking technology gives Changxin Storage the ability to enter the field of high-end AI hardware production. The technological gap between Chinese storage manufacturers and leading Korean companies that has existed since the early stages of industry development is being significantly narrowed.
Only three years after Changxin Storage officially entered the HBM professional field, it achieved a key breakthrough in mass production of 12-layer HBM. The core difficulty of HBM manufacturing is the difficult vertical stacking process including precise bonding of DRAM layers. Changxin Memory’s complete mastery of this technology directly reflects that China’s local semiconductor ecosystem has reached an advanced level of development.
Industry observers stated,Samsung Electronics and SK Hynix have dominated the global HBM market all year round. Currently, the manufacturing capacity gap between Changxin Memory and the two Korean leaders has been shortened to less than three years.
In terms of mass production layout, Changxin Storage chose to expand its market influence through production capacity scale. Reports show that the company has invested approximately 20% of its total DRAM production capacity in HBM manufacturing. After completing the production capacity transformation, its monthly HBM wafer production capacity can reach 60,000 wafers. At present, the production yield rate of Changxin Memory is still lower than that of its Korean competitors. Its core goal at this stage is to fully meet the market demand for domestic AI products and at the same time make a strategic layout for entering the international market in the future.
In order to maintain its development momentum and expand its production capacity, Changxin Storage is planning to raise US$4.2 billion through IPO. The funds will be used to build new HBM production facilities and upgrade existing DRAM manufacturing centers.
The company is currently working closely with domestic and foreign equipment suppliers. The core production infrastructure is expected to be completed in 2026, and the funds will also help it further optimize bonding technology and thermal management systems.
The launch of Changxin Storage's 12-layer HBM products has brought increasing competitive pressure to market leaders such as Samsung and SK Hynix. The latter must accelerate the advancement of more advanced manufacturing technologies to maintain its industry leadership.
Industry experts predict that the next stage of competition in the global storage industry will focus on the development and implementation of 16-layer stacking and hybrid bonding technology.
