According to TrendForce,Since the beginning of 2026, as HBM4 shipments have increased rapidly, Samsung has begun to increase the price of 4nm basic die by 40% to 50%.At the same time, Samsung’s 4nm production line is operating at close to full capacity, and the overall profitability of the wafer foundry business is showing a gradual improvement trend.
Samsung announced mass production of HBM4 memory in February this year and has shipped commercial products to customers. This solution uses the basic die of the 4nm process and uses the 1cnm process to manufacture DRAM chips. Samsung said it has achieved stable yield rates and industry-leading performance in the early stages of mass production.
Samsung has also prepared basic die of the same process for HBM4E and plans to put it into production within this year. It is rumored that Samsung also plans to introduce 2nm process to manufacture basic die in HBM4E to improve energy efficiency, heat dissipation management and area utilization.
Thanks to the improvement in yield rate, Samsung's wafer foundry business has shown an upward trend recently.Samsung has set a new goal for this: to achieve profitability within two years and occupy 20% of the market share. At the beginning of this year, the overall capacity utilization rate of Samsung's wafer fab has increased to 60%, and is expected to reach the break-even line of 80% soon.
It is reported that Samsung's wafer foundry business may achieve profitability in the fourth quarter of this year and usher in a more obvious improvement cycle next year.In addition, with the increase in 4/5nm process orders, Samsung has notified customers in the fourth quarter of 2025 that it will increase 4/5nm foundry prices.
