SK Hynix has released a temperature-controlled heat dissipation storage technology called "iHBM".The heart of the technology lies in its newly developed cooling element "ICE", which is made from an insulating, highly thermally conductive silicon-based material.
Traditional HBM products mainly rely on indirect heat dissipation in which heat is conducted outward through the core chip, while iHBM directly embeds ICE in the D2D PHY area where heat is most concentrated, building a dedicated heat discharge channel for this area.
Compared with traditional solutions,The thermal resistance of iHBM is reduced by more than 30%, which effectively guarantees the stability of product operation in harsh environments such as high temperature and high load.
In terms of mass production feasibility, iHBM adopts the advanced MR-MUF wafer-level packaging process that has been widely proven in the market, enabling large-scale and stable mass production.
In addition, this technology has high design compatibility with customers’ existing system-level packaging environments, and customers can deploy it directly without making large-scale design changes, thus effectively lowering the technical threshold for actual introduction.
SK hynix plans to apply iHBM technology to next-generation products such as HBM5 to meet the heat dissipation management needs in ultra-high integration and high-bandwidth application scenarios such as high-performance computing and AI data centers.