On May 28, Nvidia CEO Jen-Hsun Huang accepted media interviews after the "Trillion Dollar Dinner" in Taipei and expressed his views on hot topics such as competition in the AI industry and self-developed chips by cloud service providers. When asked about the "Tao (τ) Law" and "Logic Folding" technologies recently released by Huawei Semiconductor, Huang Renxun bluntly said that this is a major technological breakthrough for Huawei, but it does not pose a threat to TSMC.
Huang Renxun explained that Huawei uses chip stacking and 3D packaging technology to double the number of transistors or even increase it by 3 to 4 times without compressing the line width of the semiconductor process. He admitted that this is a very excellent technical path, but he also pointed out that TSMC has been deployed and applied in related fields for nearly 10 years, and its technology accumulation is profound and very advanced.
It is reported that He Tingbo, director of Huawei and president of the Semiconductor Business Department, officially released the "Tao (τ) Law" at the 2026 International Circuits and Systems Symposium held on May 25. This is the first time that a Chinese company has proposed new principles for leading industry development in the global semiconductor field, which immediately triggered extensive discussions within the industry. This law builds a multi-level collaborative optimization system covering devices, circuits, chips and system levels. It is expected that by 2031, the transistor density of high-end chips based on this law will reach the same level as the 1.4nm process.