At the recent Eighth China International Import Expo, the Dutch ASML company demonstrated two new lithography machines in China, TWINSCAN XT:260 and TWINSCAN NXT:870B. However, these two lithography machines are not used in the situations that everyone usually comes into contact with.It is not used for chip lithography production, but for advanced packaging fields such as 3D packaging.
Netizens who are familiar with the domestic lithography machine industry may understand that now it is not Microelectronics to grab ASML's DUV/EUV lithography machine business, but ASML to grab the packaging lithography machine business of domestic companies.
TWINSCAN XT:260 and TWINSCAN NXT:870B are i-line lithography machines. The light source is 365nm, scanning exposure, the resolution is no higher than 400nm, NA 0.35, the wafer output can reach 270 wafers per hour, and can handle 300mm wafers with a maximum thickness of 1.7mm, instead of the usual 775um thickness wafers.
ASML said that compared with Canon FPA-5520iV and other models, the production efficiency of this lithography machine is four times higher.
As for TWINSCAN NXT:870B, it is a more advanced KrF lithography machine with a wavelength of 248nm.The resolution has been increased to no higher than 110nm, NA 0.8, the wafer output per hour has been increased to 400, and the production efficiency is higher.
It can be seen from ASML's move that high-end lithography machines are important, but as advanced packaging has become a key part of AI chips, ASML is also seeking new development points and including packaging lithography machines in the scope of market promotion. Although this kind of lithography machine does not cost two to three billion US dollars per unit, it is used in large quantities and its development prospects are not bad.
At the same time, domestically, ASML's EUV lithography machine cannot be sold for reasons that everyone knows, but the accuracy of the packaging lithography machine is no longer limited, and ASML intends to expand this market.