Today, the official website of the China Securities Regulatory Commission disclosed the filing notice for the "full circulation" of Shanghai's GPU chip leader Biren Technology's overseas issuance and listing and domestic unlisted shares. Biren Technology plans to issue no more than 372,458,000 overseas listed ordinary shares and list them on the Hong Kong Stock Exchange.
According to the filing notice, 57 shareholders of Biren Technology plan to convert a total of 873,272,024 domestic unlisted shares held into overseas listed shares and list them on the Hong Kong Stock Exchange.
Its shareholder list and conversion amounts are as follows:
Biren Technology launched an A-share IPO in September 2024. The listing guidance filing report at that time showed that Biren Technology was founded on September 9, 2019, with a registered capital of 32.9164 million yuan, the legal representative is Xiao Bing, and the registered address is in Minhang District, Shanghai.
According to the official introduction, Biren Technology is committed to developing original general-purpose computing systems, establishing efficient software and hardware platforms, and providing integrated solutions in the field of intelligent computing.
Biren Technology will first focus on general intelligent computing in the cloud, gradually catch up with existing solutions in multiple fields such as AI training and reasoning, and achieve a breakthrough in domestic high-end general intelligent computing chips.
Its first general-purpose GPU product, the Bili series, launched in August 2022, has been put into mass production and has been deployed in a wide range of application scenarios including large models and generative AI.
Previously, the Shanghai AI Laboratory teamed up with more than ten partners, including Bi Ren, to build a prototype of a super-large-scale cross-domain hybrid training cluster in Shanghai. It has completed 20 days of uninterrupted long-term training on a self-developed model with hundreds of billions of parameters, and the efficiency has reached 90% of that of a single-chip cluster. Among them, Biren Technology's HGCT unified heterogeneous communication library has in-depth cooperation with the DeepLink open computing system. For the first time in the industry, four types of heterogeneous GPUs have been implemented for large-scale mixed training of large models with 100 billion parameters.
In July this year, during the 2025 World Artificial Intelligence Conference (WAIC), Shanghai Insitu, together with Xizhi Technology, Biren Technology, and ZTE, released the country’s first optical interconnection and optical switching GPU super node - Optical Leap LightSphere X. The super node uses Biren Technology’s independent and original architecture of a large computing power general-purpose GPU liquid cooling module and a new carrier board interconnection.
The "Distributed OCS All-Optical Interconnect Chip and Super Node Application Innovation Solution" jointly created by Xizhi Technology, Biren Technology, and ZTE also won the "SAIL Award", the highest award at the 2025 World Artificial Intelligence Conference. This is also the second time Biren Technology has won this honor after winning the SAIL Award in 2022.
In September this year, Biren Technology celebrated its sixth anniversary. Zhang Wen, founder, chairman and CEO of Biren Technology, delivered a speech on the spot, saying that the first echelon of the AI chip market has been formed and the market is accelerating differentiation. In the future, Biren Technology will use talents as the cornerstone, management as the engine, and supply chain as a strong backing, and strive to create hexagonal all-round products that meet market demand.