Intel's stock price has been rising sharply recently, and it rose by more than 6% last night. Its market value has returned to the US$500 billion mark, a surge of more than 4 times in one year. In addition to the revaluation of the AI value of x86 CPU business by Wall Street, Intel's surge is also related to the steady improvement of Intel's chip technology. At the financial report meeting a few days ago, Intel stated that the 18A process yield rate has improved beyond expectations and will reach the standard by the end of this year ahead of schedule, and the 14A process under development is even better than expected.
But what can bring customers to Intel may be their chip packaging technology EMIB.This is also Intel's exclusive 2.5D packaging technology that has been developed for many years. It has two products, EMIB-T and EMIB-M.
The latter introduces a silicon bridge circuit designed with MIM capacitors, which can reduce noise and improve power transmission signals and integrity. Although the cost is a bit higher, its better stability and lower leakage characteristics will attract high-end customers.
With EMIB packaging technology in hand, Intel is fully capable of grabbing a lot of CoWoS packaging orders from TSMC. The latter is not only full of production capacity, but also has high foundry prices, which to a certain extent is more restrictive than advanced process foundry.
A report from Wall Street analyst Jeff Pu said,The yield rate of Intel's EMIB packaging technology has exceeded 90%.The project is progressing smoothly and is expected to provide important support to Intel's foundry business.
Among potential customers, Google's next-generation TPU and NVIDIA's next-generation GPU Feynman have plans to introduce Intel's EMIB package. Meta will also be one of the important customers, but the latter's cooperation will not be realized until the 2028 CPU.
