The United States has for years tried to slow China's progress in areas such as semiconductors and artificial intelligence through sanctions and export controls. Intel's CEO commented that this strategy is affecting China's semiconductor manufacturing capabilities and highlighted cooperation with countries such as Japan and the Netherlands. These comments coincide with statements from TSMC and NVIDIA, although supply chain uncertainty remains in this highly connected industry.

Speaking at the World Economic Forum in Davos, Intel CEO Pat Gelsinger asserted that China's semiconductor development will lag behind leading countries by a decade due to U.S. sanctions on key chip manufacturing components.

Gelsinger explained that China’s existing tools can currently only produce 14-nanometer and 7-nanometer chips. In contrast, companies such as Taiwan's TSMC, South Korea's Samsung and the United States' Intel are preparing to use more advanced processes to produce 3nm, 2nm and even more sophisticated semiconductors in the next few years. TSMC’s 2nm chips are expected to be used in the iPhone 17, which will be launched in 2025.

In response to China's rapid development in the chip field, the United States has promulgated relevant control measures to prevent China from obtaining the tools needed for the latest chip technology. However, the United States did not stop China alone, but combined the cooperation of allies Japan and the Netherlands, which was a key factor in the effectiveness of this policy.

ASML is a Dutch company and the world's largest supplier of lithography tools critical to the production of semiconductors below 14 nanometers. The move is part of Intel Corp's efforts to regain its lead in chipmaking after falling behind Taiwan Semiconductor Manufacturing Co. and Samsung Electronics Co.

At Davos, Gelsinger discussed the fragility of global supply chains, an issue that has been revealed during the COVID-19 pandemic. He pointed out that decades of industrial policy have concentrated chip manufacturing in Asian countries, and the United States is currently trying to reverse this trend through the Chip Act. This legislation is intended to increase U.S. technological self-sufficiency.

Last year, TSMC founder Chang Chung-mou acknowledged that U.S. sanctions could benefit TSMC temporarily but expressed doubts about the long-term effectiveness of such measures. He predicted that the sanctions would leave China years behind in chip manufacturing technology. However, he also pointed out that countries like the United States need a lot of time to develop their own chip manufacturing capabilities.

U.S. officials are optimistic that the United States can begin producing and packaging the most advanced semiconductors within a decade. In contrast, NVIDIA's CEO believes this goal may take 10 or 20 years.