[The total investment in the first and second phases of Hubei Xingchen 3D advanced packaging mass production line project exceeds 7 billion yuan] "Science and Technology Innovation Board Daily" reported on the 30th that today, the second phase of the advanced packaging pilot platform project of Hubei Xingchen Technology Co., Ltd. was officially put into line. According to him, this project is the first 3D advanced packaging mass production line in China. The total investment in the first and second phases of Xingchen Technology's advanced packaging comprehensive experimental platform exceeds 7 billion yuan, of which the second phase project will start in October 2025. After the production line is fully completed, it can simultaneously carry out pilot and risk mass production of 40 to 50 types of chips, as well as performance verification of 30 to 40 sets of domestic semiconductor equipment and materials. (Kechuangban Daily reporter Yu Shiqi)