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[Samsung is reported to use TSMC’s 3nm process to produce next-generation HBM substrate dies for Nvidia] On October 19, it was reported that Samsung Electronics plans to use TSMC’s 3nm process to produce Nvidia’s next-generation customized high-bandwidth memory (HBM) substrate dies. It is reported that Nvidia hopes that suppliers will unify their manufacturing processes to ensure performance consistency, and has required Samsung, SK Hynix and Micron to use TSMC's 3nm process in the production of NVHBM base die. This move marks the first time Samsung will cooperate with TSMC in the HBM manufacturing stage.
TSMC 🕐 2026-10-19 07:54
#NVIDIA #TSMC #Samsung #Memory #HBM
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