[Shenzhen’s “Tengfei Loan” and others helped nearly 12,000 technology companies obtain loans exceeding 30 billion yuan] On October 23, the Shenzhen Branch of the People’s Bank of China and the Shenzhen Branch of the State Administration of Foreign Exchange held a press conference for the third quarter of 2026. In terms of science and technology finance, "Tengfei Loan", "Technology Start-up Pass" and "Seed Loan" have helped nearly 12,000 technology companies obtain loans of more than 30 billion yuan, and the "Technology Board" of the bond market has issued bonds of more than 150 billion yuan; using technological innovation and technological transformation re-loan policies to support more than 4,000 technology-based small and medium-sized enterprises, nearly 200 technological transformation projects have received loans of more than 78 billion yuan. Recently, the central bank increased the re-loan quota for technological innovation and technological transformation by 200 billion yuan, and made it clear that private small and medium-sized enterprises with high R&D investment levels will be included in the scope of re-loan support on a pilot basis in Shenzhen and other international science and technology innovation center cities.