[Osconn: Plans to invest 6 billion yuan in building an intelligent computing and high-speed interconnection PCB industrial base project] On October 28, Oscon (002913.SZ) announced that the company signed an "Industrial Project Development Agreement" with the Haimen Economic and Technological Development Zone Management Committee to invest in the construction of the "Osconn Nantong Intelligent Computing and High-speed Interconnection PCB Industrial Base Project". The total planned investment is expected to be 6 billion yuan, which will be invested in three phases, of which the first phase investment is about 2.5 billion yuan. The first phase plans to build 4-5 factories, mainly producing high-end, high-multilayer, high-frequency and high-speed PCB products, which will be used in artificial intelligence, smart cars, high-end communications and other fields. The project land area is about 907 acres, and the first phase land area is about 408 acres. Whether to start the second and third phases will be decided by the company independently based on the operating conditions of the first phase. This investment still needs to be submitted to the shareholders' meeting for review.