B · Normal
[Shennan Circuit: FC-BGA packaging substrates already have mass production capabilities for products with 26 layers and below] November 1st, Shennan Circuit recently stated in an institutional survey that in the third quarter of 2026, the company's Guangzhou production base will steadily release production capacity, and product line capabilities will continue to improve. Among them, the production capacity of BT packaging substrates is steadily increasing; FC-BGA packaging substrates have the mass production capacity for products with 26 layers and below, and the technology research and development and proofing work for products with 30 layers and above are progressing as scheduled.
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