[Hongda Electronics: Plans to raise no more than 1 billion yuan in additional capital to invest in tantalum capacitor and ceramic film circuit projects] On November 9, Hongda Electronics (300726.SZ) announced that the company plans to issue A shares to specific targets, and the total raised funds will not exceed 1 billion yuan. After deducting the issuance costs, it will be used for the industrialization construction project of chip polymer tantalum capacitors and ceramic film circuits and SLC industrialization projects. Among them, the chip polymer tantalum capacitor project has a total investment of 581 million yuan, with 530 million yuan of raised funds planned to be invested; the ceramic film circuit and SLC project has a total investment of 502 million yuan, with 470 million yuan of raised funds planned to be invested.