B · Normal
On November 12, South Korean President Lee Jae-myung stated that Samsung invested 6 trillion won in building an HBM chip packaging factory in Asan, South Korea, and will invest approximately 40 trillion won in advanced equipment in the future.
🕐 2026-11-12 09:30

Related telegraphs

Comments

0/500
Captcha (click to refresh)
No comments yet