[Changdian Technology: It plans to raise no more than 6.5 billion yuan in additional funds for high-performance computing high-end advanced packaging platform expansion projects, etc.] On September 3, Changdian Technology (600584.SH) announced that the company plans to issue A shares to specific targets to raise a total of no more than 6.5 billion yuan, with The project includes high-end advanced packaging platform expansion projects for high-performance computing, high-end power module advanced packaging and testing capacity upgrade projects, wafer-level packaging advanced process platform upgrade and capacity expansion projects, high-density and large-capacity memory chip system-level packaging and testing capability upgrade projects, as well as replenishing working capital and repaying bank loans.