[Shenzhen Technology: Subsidiary plans to invest 1.85 billion yuan to expand high-end memory chip packaging and testing production capacity] On September 9, Shenzhen Technology (000021.SZ) announced that the company’s wholly-owned subsidiary Payton Technology plans to further implement a high-end memory chip packaging and testing production capacity expansion project. The total planned investment of the project is 1.85 billion yuan. First, it is planned to invest 1.22 billion yuan to build a new wholly-owned subsidiary to build a new factory. It is estimated that it can carry 90,000 pieces/month of traditional packaging and testing and 10,000 pieces/month of 2.5D advanced packaging production capacity. Second, it is planned to invest 630 million yuan to build a 2.5D/3DS advanced packaging R&D line. After the completion of the project, it is expected to increase the 2.5D/3DS advanced packaging production capacity by 100 pieces/month. The project is planned to be completed in December 2028.