[Huawei releases the world's first 3D data center] According to the Science and Technology Innovation Board Daily on the 15th, Huawei today released the world's first 3D data center, published the "3D Data Center" monograph, and opened the "3D Data Center Outline Design Gallery". The 3D data center draws on the concept of strict separation of the "power layer" and the "production layer" of the chip factory, and vertically superimposes the various functional spaces deployed horizontally in the traditional data center to form a four-layer architecture from bottom to top, including the cooling layer, IT equipment layer, power supply layer, and backup power layer. Wang Tao, Vice Chairman and Rotating Chairman of Huawei, said that large models with 10 trillion parameters and rapidly growing token demand have put forward higher requirements for AI infrastructure, and Ascend super-node clusters with more than 100,000 cards will become the basic configuration. The 3D data center supports the super computing power factory of the Ascend super node cluster through hierarchical decoupling and three-dimensional stacking. (Kechuangban Daily reporter Huang Xinyi)