[Boway Alloy: Indirectly supplying NVIDIA Rubin through downstream manufacturers. The high-purity oxygen-free copper material has been recognized by international heat dissipation manufacturers] September 16th, according to Bowei Alloy official Weibo news on the 16th, NVIDIA recently announced that Vera Rubin has been fully put into production. Wang Yongsheng, secretary of the Board of Directors of Boway Alloy, said in an interview with the media that the company's related products indirectly provide Nvidia with Boway 19920 (high-speed backplane connector material) and PWHC985 (high-purity oxygen-free copper heat dissipation material) through downstream manufacturers. Previously, Bowei Alloy's high-purity oxygen-free copper products have overcome the industry's pain points of blistering and leakage during liquid cooling plate welding. CoolerMaster has provided it with an annual demand forecast of 20,000 tons. It has now been supplied in batches, and the relevant production capacity is undertaken by Vietnam's new material base. At present, Bowei Alloy's high-purity oxygen-free copper material has been recognized by international heat dissipation manufacturers. Among them, the liquid cooling plate material matching GB300 has been successfully verified and shipped according to customer needs. The Rubin architecture micro-channel liquid cooling material has also passed the product and production line certification of downstream customers. Wang Yongsheng said that in the future, when the commercialization process of solid-state batteries accelerates, the company's international supply capabilities will be greatly improved. At the same time, the company will also evaluate the production capacity of heat dissipation materials in Vietnam, and there is room for further expansion of domestic production capacity.