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[Mengage Technology: CXL3.2 chip will be introduced into Samsung SK Hynix PCIeSwitch tape-out within the year] On September 3, Montage Technology (688008.SH) released an investor relations activity record announcement. In July, the company took the lead in trial production of CXL3.2MXC chip in the industry and successfully introduced the next generation CXL products of Samsung and SK Hynix. It is expected to enter the first year of large-scale commercialization of CXL in 2027. The PCIeSwitch chip is expected to complete the engineering sample tape-out within this year. The PCIe6.x/CXL3.xRetimer chip has completed the mass production version tape-out and is included in the PCI-SIG supplier list. It is planned to complete the PCIe7.0Retimer and Ethernet PHYRetimer chip engineering sample tape-out this year. Samples of the sixth-generation DDR5 RCD chip have been sent, supporting a speed of 9200MT/s. The fifth-generation RCD chip has begun large-scale shipments, and the combined shipment share of the third- and fourth-generation generations has exceeded 50%. The second-generation MRCD/MDB chip is in the large-scale trial stage, and large-scale production needs to wait for the mass production of the new generation CPU next year. The clock chip has received mass production orders, and the high-precision RTC chip is expected to complete engineering sample tape-out in the second half of the year. The increase in the CPU configuration ratio of AI servers will drive the growth in demand for memory modules and interconnect chips.
#Switch#CPU#server#chip#Samsung#Memory#Institutional research trends09-03 15:34