Today, Intel officially announced that,Mass production based on industry-leading semiconductor packaging solutions has been achieved and can continue to advance Moore's Law after 2030.This progress will not only gain competitive advantages in the performance, size, and flexibility of design applications of chip products, but will also promote Intel's next stage of advanced packaging technology innovation.
Intel said that at its newly upgraded Fab9 factory in New Mexico, the United States, it has achieved mass production based on industry-leading semiconductor packaging solutions.These include Foveros, Intel's breakthrough 3D packaging technology.
It is understood that Intel Foveros is a 3D advanced packaging technology. During the manufacturing process of processors,Ability to stack compute modules vertically instead of horizontally.
Packaging technologies such as Intel’s Foveros and EMIB,It is possible to integrate one trillion transistors in a single package,And continue to advance Moore's Law after 2030.
Moore's Law is the experience of Gordon Moore, one of the founders of Intel. Its core content is:
The number of transistors that can be accommodated on an integrated circuit doubles every 18-24 months.The performance of processors doubles approximately every 2 years, while the price drops by half.
Intel CEO Pat Gelsinger previously said, "For those critics who declare that we (Moore's Law) are dead, we will never stop until the periodic table of elements is exhausted!"