Apple will reportedly switch to resin-coated copper foil (RCC) as its new printed circuit board (PCB) material in 2024. The change will allow Apple to make its printed circuit boards thinner. The current iPhone printed circuit board is made of flexible copper substrate material. Thinner printed circuit boards could free up valuable space inside compact devices like the iPhone and Apple Watch, providing more space for larger batteries or other components.
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Apple Online Store (China)
The size of the iPhone 16 Pro models is expected to increase from 6.1 inches and 6.7 inches to 6.3 inches and 6.9 inches respectively. The increase in size is believed to be partly due to the need for more internal space to fit additional components, such as a quad-prism telephoto camera with 5x optical zoom and a capacitive "capture" button.
This information comes from an integrated circuit expert on Weibo, who first reported that the iPhone 14 will retain the A15 Bionic chip, and the A16 chip is unique to the iPhone 14 Pro model. Recently, this netizen said that the A17 chip designed for iPhone16 and iPhone16Plus will use a completely different manufacturing process from the A17Pro of iPhone15Pro to reduce costs.