Samsung Electronics announced plans to mass-produce HBM4 memory by 2025 to diversify manufacturing services and meet industry needs. Sang Joon Hwang, head of the DRAM product and technology team at Samsung Electronics, revealed the development in a blog post on Samsung Newsroom, claiming that the company plans to enhance the status of its memory division. The following is what the executive revealed about Samsung’s past development in the HBM field:
Visit the purchase page:
SAMSUNG-Samsung Flagship Store
Samsung mass-produced HBM2E and HBM3 and developed the 9.8 gigabits per second (Gbps) HBM3E, which we will soon start providing samples to customers to enrich the HPC/AI ecosystem.
Looking ahead, HBM4 is expected to launch in 2025, with technologies optimized for high thermal performance such as non-conductive film (NCF) assembly and hybrid copper bonding (HCB) currently being developed.
Information provided in the post shows that Samsung has gained interest from potential customers for its HBM3 memory process, with companies such as NVIDIA leading the way. With the development of artificial intelligence (genAI), the requirements for related hardware have reached new heights, so the demand for necessary components such as HBM3 has also increased rapidly.
Nvidia is trying to diversify its supply chain, and Samsung Electronics comes in handy here as the company has ample equipment to meet the DRAM demand for AI accelerators.
In addition to the progress of the current generation, Samsung also plans to quickly advance the next-generation HBM4 process, which is expected to be unveiled in 2025. While there are not many specific details about the memory type, Samsung revealed that HBM4 will use "non-conductive film" and "hybrid copper bonding", which will help improve the energy efficiency and heat dissipation performance of the memory process. HBM4 will indeed mark the transition to the next generation of artificial intelligence accelerators, opening new doors to the industry’s computing power.
Samsung is becoming a "differentiated" supplier, especially as the company focuses on developing chip packaging equipment. Given the company's success in gaining the trust of potential customers, we're likely to see the Korean giant's memory division regain its prominence in the coming years.