Broadcom announced the launch of 3.5DeXtremeDimension system-level (XDSiP) packaging platform technology, which is the industry's first 3.5DF2F packaging technology.It is reported that 3.5DXDSiP is a novel multi-dimensional stacked chip platform that combines 2.5D technology and 3D-IC integration using Face2Face (F2F) technology to support consumer AI customers in developing next-generation custom accelerators (XPUs) and computing ASICs. 3.5DXDSiP provides the most advanced and optimized SiP solutions to support large-scale AI applications.
This innovative platform powers a new era of custom computing with a 7x increase in signal density between stacked dies compared to F2B technology.
At the same time, it has excellent energy efficiency. By using 3DHCB instead of planar Die-to-DiePHY, the power consumption of the Die-to-Die interface is reduced to one-tenth of the original.
Additionally, the platform minimizes latency between compute, memory and I/O components in the 3D stack. It also supports smaller adapter boards and package sizes, thereby saving costs and improving package warpage.
Officials stated that there are a total of 6 3.5DXDSiP products under development and will begin shipping as soon as February 2026.