SK hynix has successfully developed the industry's first efficient heat dissipation mobile DRAM using "High-K EMC" material and has begun supplying it to customers. EMC (Epoxy Molding Compound) is a key packaging material in the semiconductor back-end process. It is used to protect the chip from external environmental influences such as moisture, heat, impact, and static electricity, and to dissipate heat.
The so-called High-K EMC refers to improving the overall thermal conductivity (Thermal conductivity) by using materials with higher thermal conductivity (K value), thereby significantly enhancing heat dissipation performance.
SK Hynix said that as on-device AI (On-Device AI) increases the demand for high-speed data processing, heating problems have become a major bottleneck affecting smartphone performance. This new DRAM product effectively addresses the heat dissipation challenges of high-performance flagship models and has been highly recognized by customers around the world.
At present, most mainstream flagship mobile phones adopt PoP (Package on Package) packaging structure, that is, DRAM is stacked on top of the mobile processor. Although this structure is beneficial to saving space and improving data transmission efficiency, it also causes the heat generated by the processor to easily accumulate inside the DRAM, thus affecting the performance of the entire machine.
In order to solve this heat dissipation problem, SK Hynix focused on improving the EMC materials used in DRAM packaging. By incorporating alumina (Alumina) into traditional silicon dioxide (Silica),Developed High-K EMC new material. Its thermal conductivity reaches 3.5 times that of traditional materials, which can reduce the thermal resistance in the vertical thermal path by 47%.
Improved heat dissipation performance not only helps maintain high-performance operation of smartphones, but also extends battery life and device life by reducing power consumption. The company expects the product to attract widespread attention and drive strong demand from the mobile device industry.
Li Gyuji, head of product development and vice president of SK Hynix PKG, said: "This product effectively solves the pain points of high-end smartphone users while improving performance, and has important market significance. We will continue to rely on material technology innovation to consolidate our technological leadership in the new generation mobile DRAM field."
