On May 25, at the International Symposium on Circuits and Systems (ISCAS 2026), He Tingbo, director of Huawei and president of the semiconductor business unit, revealed that the Kirin mobile phone chip, which will be released this fall, will use "logic folding" technology for the first time. According to the digital blogger "Weibo Chat Station", official information shows that the transistor density of Kirin 2026 (tentative name) reaches 238 MTr/mm², which is 53.5% higher than the traditional 2D design; the P-core energy efficiency is increased by 41%, and the peak frequency is increased by 12.7% to 3.1GHz, breaking the 3GHz mark for the first time.
For reference, the frequency of the current Kirin 9030 is 2.75GHz. Huawei also looks forward to the follow-up roadmap, predicting that the transistor density will exceed 400 MTr/mm² in 2031, with the main frequency reaching 5.0GHz.
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