TSMC announced that its first wafer fab in Japan will officially open on February 24 and will be officially put into production in the second half of the year.TSMC’s Japan wafer fab is located near Kumamoto Prefecture.N2828nm process chips will be produced, which is the most advanced semiconductor process in Japan.
22ULP processIt will also be produced here, but note that it is not 22nm, but a variant of 28nm designed for ultra-low power devices.
This process is obviously not enough for high-performance CPUs, GPUs, and SoCs, butIt is still sufficient for chips in the automotive and consumer electronics fields., and the market demand in this part is also huge, and a large number of companies in Japan are still using this type of chips.
When the wafer fab is fully operational, it will create about 1,700 jobs. It currently employs about 1,400 people, and about 250 more people will join this spring.
TSMC will also build a second wafer fab near Kumamoto Prefecture, and the manufacturing process will be upgraded to the N16 level, including different versions such as N16, N12, and N12e.
TSMC is even considering a third Japanese wafer fab. It is said that it may be upgraded to the current most advanced 3nm process, but this span is a bit too big.