3D packaging is here, can the era of universal AI be far behind?On September 19, 2023, Intel officially released its first processor platform based on Intel4 process technology-Meteor Lake. Thanks to the advanced Foveros3D packaging technology, MeteorLake has implemented a new separated module structure, dividing the traditional single-processor design into a multi-module design. MeteorLake's processor will consist of computing module, IO module, SoC module, and graphics module, creating a processor with better energy consumption ratio through a new architecture.
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Source: Intel
Unfortunately, Intel has not yet disclosed the exact specifications of the 14th generation Core processors. The relevant details are expected to wait for another press conference, which is expected to be in October. However, compared to the specifications of the new generation of processors, the various changes in Intel 4 are more concerning. This is another drastic change in the structure of the processor that Intel has made after the 12th generation Core, and even introduced many new features that are not available in traditional PC processors.
Source: Intel
After AI large models became popular, Intel may have been the fastest among all PC processor manufacturers to follow up. In the 14th generation Core processors, we have already seen the neural network processing unit (NPU) prepared for AI. Earlier, Intel announced a number of large AI models based on processor design, including models designed for low-power processors, allowing users to deploy small-scale AI locally to process some text work.
After the 14th generation Core processors, PC processors will also enter a new era.
Brand new architecture, what’s new?
Traditional PC processors are basically single-core structures. A few processors place two chips on a substrate to form a processor. However, from the perspective of the chip itself, it still continues the traditional chip design method, but combines two chips into one.
The MeteorLake architecture adopts a separate module design, so even if you open the top cover, you will still only see one chip. In fact, four independent modules are packaged in the chip, which together form a processor. Among them, the computing module is the previous processor core, with built-in latest generation energy efficiency core and performance core. Through the update of process technology and micro-architecture, the performance is further enhanced and brings a higher energy consumption ratio.
Source: Intel
The graphics module integrates Intel's sharp graphics architecture. Because of the separate module design, Intel can package a larger GPU into the chip. The core display performance of the Meteor Lake processor reaches the independent display level and will support the ray tracing core IntelXeSS.
The IO module has the smallest upgrade in terms of functionality. It integrates the Thunderbolt 4 protocol and PCIe Gen5.0, which is basically the same as the previous generation.
Finally, let’s take a look at the SoC module. This is the biggest change in this update of the Meteor Lake processor. In the SoC module, Intel has adopted a new low-power island design, integrating a neural network processing unit (NPU) and a new low-power energy-efficiency core to further optimize the balance between energy saving and performance. The SoC module also integrates a memory controller, media codec processing and display unit, supports 8KHDR and AV1 codecs as well as HDMI2.1 and DisplayPort2.1 standards, and also supports Wi-Fi, Bluetooth and Wi-Fi6E.
Source: Intel
This is the first time that the NPU unit has been packaged into Intel's PC processor. As a processing unit specialized in neural network performance, the addition of the NPU can allow the 14th generation Core processor to have AI performance that far exceeds all previous processors. certainly,This doesn’t mean that previous processors didn’t have AI performance, but the logic at that time was to use the computing power of the CPU and GPU to force simulation calculations through the algorithm. The advantage was strong adaptability, but the disadvantage was that the energy consumption ratio was low and a large amount of CPU and GPU computing power was occupied, resulting in limited user experience.
After the NPU is added, the processor can hand over the performance calls related to AI functions to the NPU. The computing power of the CPU and GPU is only used as an auxiliary and backup, allowing users to run AI functions without affecting the normal use of the computer. With the rise of large AI models such as ChatGPT, AI is becoming a part of our daily lives. However, current AI generally runs on remote servers, which not only brings the risk of information leakage, but also reduces the scope of application.
Source: Intel
If we want to turn AI into a true portable assistant, improving the AI performance of personal terminals such as PCs has become an urgent issue. Using the computing power of NPU, we can easily deploy small AI models locally without resorting to high-power-consuming hardware such as independent graphics cards. Moreover, it can be more easily transplanted to the mobile terminal, so that the AI voice assistant of portable mobile devices also has more powerful intelligence.
It is not that no one has thought about adding NPU to the processor before, but due to various problems, they were ultimately unable to successfully open up a new section in the processor to place the NPU. So how did Intel do it?
3D packaging is coming
Behind the birth of the Meteor Lake processor is inseparable from Intel's new generation 3D packaging technology-Foveros. Although it has been experimented on mobile processors as early as 2020, the technology at that time was not yet fully mature, so Lakefield has become Intel's only 3D packaging PC processor in the past three years.
Source: Intel
What is 3D packaging? To use an analogy, traditional 2D packaging is to build a bungalow, while 3D packaging is to build a double-layer house. A special carrier layer is added to the upper layer of the original chip and additional modules such as NPU are placed in it. Compared with traditional separate packaging, 3D packaging can provide higher connection bandwidth and lower latency while keeping the size of the processor unchanged, ensuring consistency in performance experience from the hardware level.
Through improvements in packaging technology, Intel can now achieve high-yield 3D packaging, which means lower costs. This is the main reason why Foveros can be used in PC processors. Previously, Foveros has been active in the server processor market with higher unit prices.
Source: Intel
While improving 3D packaging technology, Intel is also developing new substrate materials to replace organic substrates that have reached the physical limit by the end of 2020. The new generation of glass substrates will have higher transistor carrying capacity, specific excellent mechanical and physical properties, and based on optical properties, it can also provide a far greater number of packages than the previous generation of substrates. It is expected that in 2030, a single package can be designed to inherit 1 trillion transistors.
With a new generation of substrates and a new generation of packaging technology, Intel is challenging the new upper limit of PC processors.
Separate module design, 3D packaging, glass substrate, a series of terms seem high-end, but what impact do they have on us? As consumers, what benefits will we get from the 14th generation Core processor? In fact, all improvements are inseparable from the two words "performance".
Of course, this may be slightly different from our traditional imagination of increasing the main frequency. Judging from previously exposed information, the main frequency increase of the 14th generation Core processor is not large, but its performance in multi-core performance, video transcoding, etc. is far superior to that of the previous generation. Behind this is the contribution of independent modules such as SoC modules and graphics modules. As processors enter the era of discrete design, the traditional main frequency can no longer represent the full performance of the processor.
Source: Intel
The three major modules of SoC, graphics, and computing are independent of each other. Enterprises can also more accurately customize the performance and functions of the processor according to user needs, allowing users to choose a processor that is more suitable for them. In the long run, this may change the future PC market. For example, enhanced computing modules can be used with high-performance PCs equipped with independent graphics cards. Enhanced graphics modules can be used with PCs that require high video transcoding performance. Enhanced SoC modules can be made into AI specialized processors.
Of course, for the time being, we will continue the existing track and differentiate performance through different models. If you want better performance, you can only spend more money.However, the 14th generation Core processor has opened the door and showed us a brand new world.