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[Agency: The high-end packaging market is expected to exceed US$51 billion in 2031] "Science and Technology Innovation Board Daily" reported on the 24th that the agency Yole Group released a report predicting that the high-end packaging market will exceed US$51 billion in 2031, nearly five times the 2025 level. This figure corresponds to a compound annual growth rate (CAGR) of 27%. At the same time, the CAGR of the number of packaging units is 33%, and the CAGR of wafer demand is 30%, indicating that the complexity and scale of packaging structures will gradually increase.
semiconductor chip 🕐 2026-09-24 13:30
#wafer #semiconductor chip
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