[Huang Renxun will meet with the heads of Samsung and SK Group in New York to discuss AI chip cooperation] "Science and Technology Innovation Board Daily" reported on the 28th that Nvidia CEO Huang Renxun will meet again with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Cui Taiyuan in New York on the 28th local time. It was about two months after the three met in San Francisco in July. HBM is the topic of greatest concern to the industry at this meeting. As the performance of AI accelerators has been greatly improved, HBM, which can transmit massive data to the GPU at high speed, has become a core device that determines the performance of Nvidia's next-generation products. Samsung plans to integrate memory, wafer foundry, and advanced packaging to enter the AI ​​chip market. This means that the relationship between the two parties is expected to expand from pure HBM supply and demand to full-process production of AI chips.