[NVIDIA and Cisco launch new pluggable optical module form factor to expand AI factory] On October 12th, NVIDIA and Cisco jointly launched a new pluggable optical module form factor USFP (Ultra-Dense Small Form Factor Pluggable), aiming to expand the network scale of AI factories. USFP is the first module to support 400Gb/s electrical signals per channel, with a single module capacity up to 12.8Tb/s, allowing AI builders to connect more computing systems without increasing network levels, while reducing transmission power consumption per bit of data. Compared with the existing 200Gb/s-per-lane optical module, the bandwidth density of USFP is increased by 4 times and the energy efficiency is increased by 1.3 times. NVIDIA and Cisco are working with TE Connectivity and Amphenol to build a multi-source hardware ecosystem around USFP.