[Huawei Xu Songyu: The next generation Kirin 2027 chip is ready] "Science and Technology Innovation Board Daily" reported on the 13th that "Science and Technology Innovation Board Daily" learned that at the 2026 Kirin Media Communication Conference, Xu Songyu, director of Huawei's Semiconductor Business Wireless Terminal Chip Product Management Department, announced the logic foldable Tao chip Kirin 9050 for the first time. Pro detailed architecture diagram, including the new generation of Lingxi CPU, Ma Liang GPU, DaVinci architecture NPU, Kirin AI ISP, Balong AI Modem, FFTS function flow task scheduler, audio and video processor, security processor and Lingxi micro-core working together. Xu Songyu revealed that the next-generation Kirin 2027 chip is also ready. So far, all test results are in line with expectations, so the evolution (logic folding) in the next 10 years is sustainable. As for the specific stage and what kind of technology is needed for each point, it may need to be carried out and discussed step by step. (Kechuangban Daily reporter Huang Xinyi)