[It is reported that Groq is planning to apply 3D stacked DRAM packaging technology to next-generation chips] "Science and Technology Innovation Board Daily" reported on the 21st that Groq is considering applying 3D stacked DRAM packaging technology to next-generation chips. This means that DRAM will be used to replace existing SRAM. Industry insiders interpreted the move as a significant increase in chip capacity by moving away from the current SRAM-centric chip design. It is reported that SRAM is fast but has limited capacity, while DRAM is relatively slow but more suitable for realizing large-capacity chips. 3D packaging technology stacks multiple semiconductor chips vertically instead of laying them flat to form a complete chip. Compared with traditional 2D packaging, it can reduce the chip surface area and improve energy efficiency. (ZDNET Korea)