B · Normal
[Advanced packaging concept rebounded with shock and linkage technology rose more than 10%] On October 28, the concept of advanced packaging rebounded in early trading, with linkage technology rising by more than 10%, followed by Lianrui New Materials, Huahai Chengke, Delong Laser, and 800 Million Spacetime. According to the news, wafer foundry and packaging and testing (OSAT) practitioners such as TSMC are planning a new round of price increases and are preparing to increase the quotation of CoWoS packaging by 10% to 20%. This packaging technology is widely used in high-end AI processors.
Live broadcast 🕐 2026-10-28 09:34
#TSMC #processor #wafer #Live broadcast #Advanced packaging #Lianrui New Materials #800 million time and space
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