B[Beijing Key Laboratory of High-Speed Optical Interconnection and Computing Technology Landed in Beijing Economic Development Zone] September 26th, according to the "Beijing Yizhuang" public account, recently, the 2026 Beijing Microelectronics International Symposium and IC WORLD Conference - Optoelectronic Integration Frontier Technology Forum was held in Yizhuang, Beijing. At the event site, the Beijing Key Laboratory of High-Speed Optical Interconnection and Computing Technology was unveiled, adding another municipal key laboratory in the field of integrated circuits in Yizhuang, Beijing. The Beijing Key Laboratory of High-Speed Optical Interconnection and Computing Technology unveiled this time is jointly built by Northern Integrated Circuit Technology Innovation Center (Beijing) Co., Ltd., Beijing Haiguangxincheng Semiconductor Technology Co., Ltd., Qiming Photonics (Beijing) Technology Co., Ltd. and Peking University. It has been officially awarded by the Beijing Municipal Science and Technology Commission and the Zhongguancun Management Committee. The laboratory will focus on the three core technology directions of heterogeneous integrated silicon photonic chips, on-chip dense wavelength division multiplexing, and advanced silicon photonic packaging to build a full-chain R&D system of "device-chip-system-packaging". B[Advanced packaging concepts fluctuated and strengthened, Huatian Technology hit the daily limit] On September 18, advanced packaging concepts fluctuated and strengthened during the session, and Huatian Technology hit the daily limit. Previously, Chengbang Co., Ltd. closed the daily limit, and Laplace, Zhongqi New Materials, Huike Co., Ltd., Torrance, Sanjia Technology, and Changdian Technology were among the top gainers. On the news, the latest industry research report released by Morgan Stanley pointed out that relying on the strong drive of the rapid development of the AI industry, the advanced packaging track has long-term growth potential, and it is expected that the domestic advanced packaging market will reach the level of 100 billion by 2029. B[Two departments: Accelerate the development of electronic design automation tools (EDA) and intellectual property cores (IP cores) and promote technological breakthroughs and applications such as three-dimensional integration] On September 15, the Ministry of Industry and Information Technology and the National Development and Reform Commission issued the "Fifteenth Five-Year Plan for the Development of Electronic Information Manufacturing Industry", which mentioned that promoting research on the entire integrated circuit chain. Develop high-end chip products such as high-performance processors, high-density memories, high-reliability analog and digital-analog hybrid chips. Improve the level of integrated circuit manufacturing, refine and mature processes, and improve advanced process capabilities. Promote the development and application of advanced packaging and testing technology. Promote the quality and upgrading of the wide-bandgap semiconductor industry, and promote the industrial development of ultra-wide-bandgap semiconductors such as gallium oxide and diamond. Continue to improve the supply capacity of key equipment, materials and parts, accelerate the development of electronic design automation tools (EDA) and intellectual property core (IP core), and promote technological breakthroughs and applications such as three-dimensional integration. B[Beijing: Accelerate the construction of fifth-generation reduced instruction set architecture (RISC-V), chip, photovoltaic and electrical integration and other innovative platforms, continue to promote the iterative evolution of new architecture products such as storage and computing integration, and focus on cultivating an independent computing industry ecosystem] On September 9, the Beijing Municipal People's Government issued the "Beijing High-Precision Industry Development Plan during the "15th Five-Year Plan" Period. It pointed out that we should adhere to the integration of the whole chain, accelerate the upgrading of the whole stack, and create a "technical base" for self-reliance and self-reliance in high-level science and technology. We will make every effort to promote chip design capabilities to the forefront of the industry, accelerate the construction of fifth-generation reduced instruction set architecture (RISC-V), chip, photovoltaic and electrical integration and other innovative platforms, continue to promote the iterative evolution of new architecture products such as integrated storage and computing, and focus on cultivating an independent computing industry ecosystem. Build the country's leading comprehensive integrated circuit manufacturing base and improve the process yield and service efficiency of mass production lines. Develop advanced packaging technology, strengthen design and manufacturing linkage, and systematically build a full-stack delivery system. Establish domestic leading electronic design automation (EDA) tools and process design kit (PDK) supporting service capabilities, and accelerate the research and development and industrialization process of characteristic processes and measurement equipment.
— All loaded —
