[China's first fully automatic board-level polishing equipment independently developed by Huahai Qingke enters the mass production line] September 9th: Recently, the fully automatic board-level CMP mass production equipment Master-P510APEX independently developed by Huahai Qingke successfully rolled out of the machine and was sent to the advanced packaging production line for mass production application. As the first fully automatic board-level CMP equipment to enter the mass production line in China, the Master-P510APEX produced this time has been systematically designed for the process characteristics of large-size board-level packaging. It has full-board uniformity and flattening control capabilities, which can meet low-defect polishing requirements. It also realizes flexible switching of multiple process modes through intelligent end-point detection and automated control, providing high-consistency, high-yield large-scale mass production support for advanced packaging production lines.